Wuhu Huishi New Material Technology Co., Ltd.

Wuhu Huishi New Material Technology Co., Ltd.

Production and sales of special industrial adhesive materials

Product Solutions

Hui clan

Semiconductor process field

Huishi Materials insists on high R&D investment in the semiconductor field, positioning itself to break through the technological blockade of the semiconductor industry, and promotes diversified innovation activities in "universities-institutes-enterprises-customers". Huishi semiconductor packaging and testing process materials are mainly used in wafer grinding, dicing and post-packaging substrate cutting.


Encapsulation and sealing tape

Encapsulation and sealing tape