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Technical support
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Production and sales of special industrial adhesive materials
Product Solutions
Semiconductor process field
Huishi Materials insists on high R&D investment in the semiconductor field, positioning itself to break through the technological blockade of the semiconductor industry, and promotes diversified innovation activities in "universities-institutes-enterprises-customers". Huishi semiconductor packaging and testing process materials are mainly used in wafer grinding, dicing and post-packaging substrate cutting.
Encapsulation and sealing tape
Contact Us
E-mail: sales@hstape.cn
Company Address:
No.3, Jing Si Lu, Chengdong Park, Wuwei Economic Development Zone, Wuwei City, Wuhu City, Anhui Province
Service Hotline:
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